SK Hynix Unveils AI CPO Technology Roadmap

SK Hynix and researchers from the University of Virginia have unveiled a next-generation Co-Packaged Optics (CPO) technology roadmap aimed at reducing connection bottlenecks in artificial intelligence (AI) semiconductors. On the 20th, the researchers published a paper in the journal Nature Electronics, outlining the development direction of CPO technology. CPO is a technology that places optical components close to processing chips or switches to reduce the distance electrical signals must travel, and demand for it is increasing in large-scale AI data centers. The paper identifies the 'bandwidth wall' as a key bottleneck in AI expansion, explaining that while processing power triples every two years, interconnection bandwidth only increases by 1.4 times. The researchers proposed CPO as a technology candidate, stating that expanding optical connections to memory interfaces could enhance memory utilization efficiency. This roadmap includes plans to extend the application scope of CPO beyond network connections to memory interfaces. However, this announcement focuses on the direction of technology rather than product release timelines.

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